Fabrication Queries

Are EGGER Laminates suitable for postforming?

All our laminates with the exception of W1001 can be postformed (lengthwise – direction in which laminate is produced). EGGER Laminate will retain its postforming properties if stored correctly for up to 6 months

In contrast to all the other laminate decors in the ZOOM® distribution collection, EGGER laminate cannot be postformed due to the special synthetic resins used in its manufacture.  (Please refer to the EGGER W1001 Technical Leaflet for further advice).

 

What is the minimum postforming radius of EGGER Laminate?

The minimum radius is 10 times the thickness of the laminate. For EGGER Laminate available from the UK the nominal thickness is 0.8mm therefore the smallest radius is > 8mm.  EGGER Laminates can be postformed into convex or concave profiles (depending on the method used).

 

What are the advised postforming methods?

- Static Postforming
If using a static postforming method, the flat surface should be bonded first, followed by the profiled edge. We recommend using PVA adhesives or urea condensation resins for flat surfaces and special vinyl type adhesives for the profile. It is essential to follow the adhesive manufacturer’s instructions at all times, particularly when using contact adhesives.

We recommend a postforming temperature of around 150 - 155°C. It is advisable to use an adipic acid temperature gauge (151°-153°C).

Please note that the end result is affected not only by the temperature and its constancy during the entire forming process, but by the pressure and length of time taken.

 

- Continous postforming
The continuous postforming process only allows for convex profiles.   Once the laminate is fixed to the substrate, the rounded edge of the panel/substrate and the unattached part of the laminate must then be coated with adhesive using a gun or roller. In the area which requires postforming, the adhesive must be then reactivated by jets of hot air (between 400 and 600°C) and then by infra-red radiating elements. The laminate is then curved by a shaping bar and applied to the rounded profile by press rollers. Postforming can take place upwards or downwards.

Our recommendations are based on our own experience. It is advisable to conduct preliminary tests on your own machinery.

 

Does it matter what temperature I postform?

It is important to achieve and maintain the correct temperature during postforming.  If the temperature is too high, it may lead to the formation of blisters and cracks and the laminate will damage.

If the temperature is too low, the laminate may dry out and lead to cracks in the profile. If this takes place the laminate should be reheated to the required temperature as quickly as possible and should remain constant throughout the entire postforming process.

 

What is a suitable substrate?

Generally chipboard, MDF, HDF, plywood panels, core boards and veneer boards are suitable substrates which can be bonded to laminates.

 

What adhesive do I need to bond EGGER Laminate to a substrate?

We advise that all materials used for bonding (substrate, laminate, adhesive) must be stored together at the same temperature. The adhesive procedure varies according to the substrate, type of adhesive (PVA adhesive, condensation resins, contact adhesives, reactive adhesives, hot melt adhesives) and the bonding process followed.   Please follow the adhesive manufacturer’s recommendations.  As a general rule, we advise applying the adhesive evenly over the entire surface.

Type of adhesive	Amount of adhesive (g/m2)	Curing time (minutes)	Pressure (bar)	Temperature and pressing time
				20°C	40°C	60°C
Dispersion adhesive
PVA	90 -150 on laminate or substrate	1-30	about 3	8-60 mins	4-12 mins	45-160 sec
Two-part PVA adhesive	90 -150 on laminate or substrate	1-30 depending on composition of elements	about 3	According to manufacturer’s recommendations
Condensation resin
Urea	90-150 on laminate or substrate	2-20	3-5	15-180 mins	5-30 mins	1-12 mins
Melamine urea	90-150 on laminate or substrate	2-20	3-5	Pressing time depends on Hardener
Resorcinol, phenol	100-180 on laminate or substrate	about 2-15	3-5	about 8 hours	N/A	N/A
Contact adhesives
With or without hardener	150-200 on laminate or substrate	Varies according to ambient temperature and type of adhesive (finger test)	At least 5	At least 1 min	N/A	N/A
With resin hardener incorporated	These are special adhesives for which it is not possible to indicate mean values
Reactive adhesives
Epoxy, unsaturated polyester and polyurethane adhesives	150-200 on laminate or substrate	Varies according to type of adhesive	Stacking pressure sufficient	Determined by type of adhesive and hardener chosen
Hot melt adhesives (thermofusible)	180-300 on laminate or substrate	Extremely brief	Roller pressure	180-220°C (temperature at which adhesive applied)

         

What tools / machinery do I need?

We recommend the use of tungsten-carbide tipped tools when machining laminates. The best results are obtained with circular saws.

If cutting by hand, it is advisable to use a fine-toothed saw holding the blade low at an angle of 10˚ to the surface.

If using a circular saw, it is important to apply sufficient pressure to prevent the substrate from moving which could result in splintering and superficial cracks.

When drilling, screw holes should be 0.5 mm larger than the screw diameter to allow the substrate to warp if the temperature or humidity varies thus preventing cracks forming near the hole.

Re-entrant angles of notches and cuts should always be rounded and machined to avoid superficial cracks.